Vol. 19, No. 13

Dec. 2, 1999

T.S. Chou named American
Society of Materials fellow

Tsu-Wei Chou, Jerzy L. Nowinski Professor of Mechanical Engineering, has been elected as a fellow of ASM-The American Society of Materials. Chou was honored at a black-tie dinner Nov. 2 at the ASM annual conference in Cincinnati. In recognizing his accomplishments, ASM cited Chou's "pioneering work in modeling microstructure-property relationships in polymer, metal and ceramic-based composites." Chou is internationally known for his research in the application of analytical techniques to the study of a broad range of materials problems. With a doctorate from Stanford University, Chou has been on the UD faculty since 1969 and was a founding member of the Center for Composite Materials. Chou and his colleague, Jack R Vinson, H. Fletcher Brown Professor of Mechanical and Aerospace Engineering, initiated courses in composite materials at UD in the 1969-70 academic year, and their effort in composites related teaching at the graduate and undergraduate levels has continued for three decades. Chou received the American Society of Mechanical Engineering (ASME) Charles Russ Richards Memorial Award in 1996, Distinguished Research Award of the American Society for Composites in 1998 and was elected an ASME fellow last year. Chou has served as a visiting professor at several institutions in Europe, South Africa, South America and Asia. He was a liaison scientist at the Office of Naval Research in London and has conducted technology assessment of advanced materials in Europe and Asia for the Army Research Office and Office of Naval Research. He is an honorary research professor of Beijing University of Aeronautics and Astronautics and Northwestern Polytechnic University of China. At UD, he has supervised numerous graduate students, postdoctorates and visiting scientists from 17 countries. The author and editor of several books in materials science and fiber composites, Chou is the North American editor of the journal Composites Science and Technology.